【US】FLEX CONFERENCE 2022 TO HIGHLIGHT LATEST FLEXIBLE HYBRID ELECTRONICS INNOVATIONS  

MILPITAS, Calif. — FLEX Conference will gather industry experts July 11-14, 2022, at the Moscone Center in San Francisco for keynotes, panel discussions, technical sessions and product-based demonstrations highlighting the latest innovations in flexible and printed electronics. The event will co-locate with SEMICON West Hybrid, North America’s premier microelectronics exhibition and conference that unites players across the entire electronics manufacturing and design supply chain.

 

Themed Electronics in Motion, FLEX Conference 2022 will focus on equipment, processes, materials and applications driving the latest flexible hybrid electronics (FHE) technology breakthroughs. The event will also showcase innovations emerging from public-private partnerships formed by SEMI Technology Communities SEMI-FlexTech, SEMI-NBMC (Nano-Bio Materials Consortium) and SEMI-NextFlex.

 

“FLEX Conference has consistently helped turn great ideas into game-changing applications for smart transportation, buildings and infrastructure; equipment sensorization; wearable and conformable medical devices; and more,” said Dr. Melissa Grupen-Shemansky, SEMI CTO and vice president of SEMI Technology Communities. “We are excited to co-locate FLEX with SEMICON West Hybrid to advance the integration of traditional rigid electronics with flexible electronics to improve the way the world works and lives.”

 

Advances in sustainability across both industries will come into focus at the Global Sustainability Summit at SEMICON West Hybrid and FLEX as flexible electronics combine new levels of processing and sensing capability with improved power usage to make the devices more eco-friendly.

 

FLEX Conference 2022 Keynote (More keynotes to be announced.)

 

Dr. Michael D. McCreary, Chief Innovation Officer, Senior VP, E Ink Corporation

 

Electrophoretic Display Technology Will Change the Look of Automobiles, Transportation and Beyond

 

FLEX Conference 2022 Breakout Sessions

 

  • FHE Applications
  • Flexible MedTech and Wearables
  • Printing and Processing
  • Reliability and Inspection
  • Strategies and Sustainability
  • Flexible Conductive Materials and Inks
  • Flexible Power
  • FHE Processing and Integration

 

The Design Automation Conference (DAC), the largest meeting in the electronic design automation (EDA) industry, will also co-locate with SEMICON West Hybrid 2022.

 

About SEMI

 

SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

 

 

 

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