【DE】The proven trade fair duo Motek/Bondexpo is ready!

The traditional trade fair duo Motek/Bondexpo opens from 04. to 07. October 2022 wil open its doors in Stuttgart. The 40th Motek, international trade fair for production and assembly automation, and the 15th Bondexpo, international trade fair for adhesive technology, expect exhibitors and trade visitors live and in person to exchange ideas.

 

Frickenhausen – The industry participants are looking forward to the top event Motek/Bodexpo in this autumn and underline the importance of this fair. “For the Zimmer Group, Motek is more closely related than any other trade fair to the success and development of the industry and companies,” confirms Achim Gauß, Managing Director of Zimmer Group. These days, the trade fair organizer Schall receives many congratulations – the 40th anniversary of Motek will be celebrated by the company’s 60th anniversary of P. E. Sound flanked. “Technology change means acceleration, dynamism, innovation and creativity – the private trade fair company Schall has been reliably at the side of the industry in these processes for 60 years,” states Ulrich Moser from IEF Werner, who is expressly looking forward to the trade fair autumn 2022 and the Motek anniversary, because it is also an anniversary of the company: IEF Werner has been there since the first Motek hour.

 

Exhibitors from the first hour even after 40 years

KMT Production and Assembly Technology from Villingen-Schwenningen is also an exhibitor of the first hour; the company has developed parallel to Motek with its 45-year company history. Also there from the beginning: Afag. “Motek is still indispensable as a point of contact for the interests of industrial automation,” says Klaus Bott, CTO of the Afag Group, who appreciates Motek as a platform for innovations in the field of handling technology, feeding technology, robotics, image processing and sensors as well as the competent professional audience. Föhrenbach has also remained loyal to Motek for over 40 years from the beginning until today. Managing Director Bianca Föhrenbach and her trade fair team are looking forward to personal encounters, exchange and many new interesting projects with customers and business partners.

 

“You can feel how much the industry expects Motek/Bondexpo,” says project manager Rainer Bachert. “Companies are intensively concerned with producing even more economically, even more economically, even more efficiently, even more reliably. For this, they must equip themselves accordingly. There is a push forward, because current events are forcing the industry on the offensive and innovating even more.” The topics of sustainability, climate protection, resource conservation and energy efficiency are currently on everyone’s lips; the practice-oriented, user-oriented working fair Motek/Bondexpo will offer trade visitors and interested parties concrete solutions for their production environment. “Motek/Bondexpo will be able to give manufacturing companies forward-looking answers to the serious questions of the present in many places,” Bettina Schall, Managing Director of the trade fair organizer P. E. Sound, safe.

 

Motek/Bondexpo: Suitable target group meets

The industry meeting point in the trade fair autumn 2022 in Stuttgart brings together providers and users of industrial production and assembly automation as well as adhesive technology. Precisely because industrial challenges are pressing, manufacturers want to advance the modernization of assembly and production automation so that their systems become even more economical, economical and efficient – in order to save costs and remain competitive while meeting the requirements of energy saving and environmental protection. “Currently, the problem situation is as complex and complex as it has not been for a long time,” says Rainer Bachert. That’s why it’s so important to be personally at the fair and to discuss concretely on an equal footing so that actionable and sustainable results can be achieved.

As a whole, digitization and automation will get a further boost. The basis for this are modern, networkable machine components and modules. Like no other platform, Motek/Bondexpo shows feeding technology, assembly systems, handling solutions, joining technology and drive elements up to date. Robotics is also a focus that should interest many system integrators. Last but not least, exciting further developments in the fields of software and AI-supported systems for production automation are expected.

 

Arena of Integration connects actors

Preparations for the Arena of Integration (AoI) are currently in full swing: Specifically, networked solutions for the digitization of order processing in assembly plant construction and in the distribution of assembly technology are presented. Efficient assembly processes through simulation-supported virtual material flow planning will be tangible as well as the configuration and 3D real-time animation in the distribution of manual assembly workstations as well as the use of Manufacturing Execution Systems (MES) in fully automatic assembly. A total of six use cases make digitized, networked production processes visible and understandable again this year.

Young companies are once again presenting their practical innovations in the start-up area. The specialist forum “Security + Automation” will again take place in cooperation with Pilz from Ostfildern. The trade fair date is set: The industry will meet in four weeks from 04. to 07. October 2022 in Stuttgart!

 

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60 years of trade fairs for markets – The recipe for success of sound fairs

Schall has developed successful business platforms with the internationally recognized trade fairs for quality assurance (Control), optical technologies, components and systems (Optatec), punching technology (Stanztec), production and assembly automation (Motek), adhesive technology (Bondexpo), plastics processing (Fakuma) as well as sheet metal processing (Blechexpo) and joining technology (Schw This resulted in completely new markets in various industries, whose protagonists are characterized by a high level of innovative strength, comprehensive system competence and practical application solutions.

 

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